Int
ern
at
i
onal
Journ
al of Ele
ctrical
an
d
Co
mput
er
En
gin
eeri
ng
(IJ
E
C
E)
Vo
l.
9
, No
.
5
,
Octo
ber
201
9
, pp.
4044
~4
052
IS
S
N: 20
88
-
8708
,
DOI: 10
.11
591/
ijece
.
v9
i
5
.
pp4
0
44
-
40
52
4044
Journ
al h
om
e
page
:
http:
//
ia
es
core
.c
om/
journa
ls
/i
ndex.
ph
p/IJECE
Sensitivi
ty and
p
ac
k
ag
in
g
i
mp
rovement
of
an LCP
p
re
ssu
re
s
ensor fo
r
i
ntr
acranial
p
ressure
m
easur
emen
t
via
FEM
s
i
mu
lation
Preedi
pat S
att
ayasoont
ho
r
n
1
,
Jackri
t
Suth
akorn
2
,
Sora
youth
Chamn
anve
j
3
1
Depa
rtment of
Biom
edi
cal
Eng
i
nee
ring
,
Fa
cul
t
y
of
Engi
n
ee
rin
g,
Mahidol
Univ
ersity
,
Thail
and
2
Cent
er
for
B
io
m
edi
ca
l
and
Rob
oti
cs
Te
chno
log
y
,
Facu
lty
of En
gine
er
ing, Mahidol
Univer
si
t
y
,
Tha
iland
3
Depa
rtment of
Surger
y
,
Fa
cul
t
y
of
Medi
ci
n
e
R
a
m
at
hibodi
Hos
pi
ta
l
,
Mahido
l
Uni
ver
sit
y
,
Th
ai
l
and
Art
ic
le
In
f
o
ABSTR
A
CT
Art
ic
le
history:
Re
cei
ved
Feb
26
, 201
9
Re
vised
A
pr
2
4
, 2
01
9
Accepte
d
Apr
30
, 201
9
A
bioc
om
pat
ible
li
qu
id
cr
y
sta
l
pol
y
m
er
(
LCP)
pre
ss
ure
sensor
is
proposed
for
m
ea
suring
i
ntra
cr
ani
a
l
pr
essure
(ICP)
in
Tr
aumati
c
Brai
n
I
njur
y
(TBI)
pat
i
ent
s
.
Fini
te
e
le
m
ent
m
et
hod
u
sing
COM
SO
L
m
ult
iph
y
si
cs
is
e
m
plo
y
ed
t
o
stud
y
the
m
ec
h
a
nic
a
l
beh
avi
or
o
f
the
p
ac
k
age
d
L
CP
pre
ss
ure
sensor
in
orde
r
to
opti
m
ize
th
e
s
ensor
design.
A
3D
m
odel
of
the
8x8x0.
2
m
m
LCP
pre
ss
ure
sensor
is
sim
ula
te
d
to
inve
st
iga
t
e
the
par
amete
rs
tha
t
significan
tly
infl
uen
c
e
the
sensor
ch
aract
er
isti
cs
und
er
t
he
uniform
pre
ss
ure
ran
g
e
of
0
to
50
m
m
Hg.
The
sim
ula
ti
on
result
s
of
the
ne
w
design
are
compare
d
to
the
e
xper
imental
r
esult
s
from
a
pr
evi
ous
design
.
T
he
resul
t
show
s
tha
t
r
educing
th
e
thicknes
s
of
the
sensing
m
embrane
ca
n
inc
rea
se
th
e
sensiti
vi
t
y
up
to
six
ti
m
es
of
tha
t
pre
viousl
y
r
epo
rte
d.
A
n
improvem
ent
of
fab
ric
a
ti
on
m
et
hodolog
y
is
proposed
to com
ple
t
e
th
e LCP packa
gin
g.
Ke
yw
or
d
s
:
Finit
e
e
le
m
ent
m
et
ho
d
In
trac
ra
nial
p
re
ssu
re
se
ns
or
LCP
MEM
S
f
a
br
ic
a
ti
on
Si
m
ulati
on
Copyright
©
201
9
Instit
ut
e
o
f Ad
vanc
ed
Engi
n
ee
r
ing
and
S
cienc
e
.
Al
l
rights re
serv
ed
.
Corres
pond
in
g
Aut
h
or
:
Jackr
it
S
uth
a
kor
n
,
Ce
nter
for
Bi
om
edical
an
d R
obotics Tec
h
nolog
y,
Faculty
of E
ng
i
neer
i
ng
,
Ma
hidol U
niv
e
rsity
,
25/2
5
P
ut
tam
on
thon
4
R
oad,
Sala
ya
, N
a
kor
n
Pat
ho
m
7
31
70, T
haila
nd
.
Em
a
il
:
j
ackr
it
.s
ut@m
ahido
l.ac
.th
1.
INTROD
U
CTION
Pati
ents
with
sever
e
t
rau
m
atic
br
ai
n
i
nju
ry
are
re
qu
ir
ed
t
o
ha
ve
thei
r
intracra
nial
pre
ssu
re
(I
C
P)
m
on
it
or
ed.
As
the
brai
n
s
well
s
the
i
ntracra
ni
al
pr
es
sure
ris
es,
a
n
ICP
of
ov
e
r
15
m
m
H
g
ca
n
har
m
th
e
brai
n
and
t
he
sp
i
nal
cord
[1
,
2]
.
Se
ver
al
co
nve
ntion
al
syst
em
s
a
re
us
e
d
to
m
ea
su
re
ICP,
with
each
syst
e
m
bein
g
su
it
able
f
or
a
pa
rtic
ular
case.
Diff
e
re
nt
dev
ic
es
are
placed
i
n
dif
fer
e
nt
are
as,
the
locat
io
n
bein
g
de
pende
nt
on
the
patie
nt’s
c
onditi
on.
E
xisti
ng
dev
ic
es
ha
ve
lim
it
a
ti
on
s,
su
ch
as:
ris
k
of
in
fecti
on,
hi
gh
c
os
t
an
d
ri
sk
of
bleedin
g
[3
-
5
]
.
New
ICP
m
on
it
or
in
g
dev
ic
es
aim
to
re
du
ce
the
ris
k
of
in
f
ect
ion
[6]
.
Mi
nim
a
ll
y
inv
asi
ve
pr
ess
ure
sens
or
s
s
hould
be
m
iniat
ur
e
in
siz
e,
transm
it
data
wirelessl
y
and
be
low
cost.
I
n
pr
e
vious
w
ork
a
Liqu
i
d
Cryst
al
Po
lym
er
or
LCP
pres
su
re
se
nsor
wa
s
pro
po
se
d
[
7]
.
LCP
is
an
ap
pe
al
ing
m
at
erial
for
this
ap
plica
ti
on
as
it
is
bio
com
patible
,
h
as
lo
w
m
oistur
e
abs
orptio
n
an
d
it
has
a
wide
ra
nge
of
chem
ic
al
resist
ances.
R
eported
app
li
cat
io
ns
of
LCP
in
a
bio
log
ic
al
en
vir
onm
ent
include:
the
us
e
of
LCP
as
a
flexible
el
ect
ro
de
f
or
neural
stim
ulati
on
[8
-
10
]
,
as
a
n
inte
rcon
nect
for
a
n
im
planted
de
vice
[
11
]
,
a
nd
as
pa
cka
ging
f
or
a
n
im
pla
ntable
sens
or
[
12]
.
G
iven
that
m
edical
gr
ade
LC
P
sh
eet
is
easi
ly
avail
able
[13]
,
it
is
an
at
trac
ti
ve
m
at
erial
f
or
the
m
ini
m
ally i
nv
asi
ve
m
easur
em
ent of
ICP.
In
a
previ
ous
stud
y
[7
,
14
]
,
an
LCP
press
ur
e
s
ens
or
wa
s
desig
ne
d
us
i
ng
t
he
s
quare
plate
theo
ry
unde
r
sm
al
l
d
eform
ation
c
onditi
on.
Give
n
that
LCP
s
hows
a
high
de
gr
ee
of
isotr
opy,
the
m
at
erial
w
as
assum
ed
to
di
sp
la
y
li
near
ly
el
ast
ic
beh
av
ior,
base
d
on
this
assum
ption
the
m
e
m
br
ane
de
flect
ion
unde
r
Evaluation Warning : The document was created with Spire.PDF for Python.
In
t J
Elec
&
C
om
p
En
g
IS
S
N: 20
88
-
8708
Sensi
ti
vi
ty
a
nd
pa
ck
agin
g
im
prove
men
t
of
an LCP
pr
ess
ur
e
sens
or
fo
r
.... (Pre
edip
at
Sa
tt
ayaso
onth
or
n)
4045
un
i
form
app
li
ed
pr
es
sure
wa
s
eval
uated
t
o
opti
m
iz
e
the
sensing
m
e
m
br
ane
siz
e.
A
Com
so
l
-
based
finite
el
e
m
ent
analy
s
is
was
us
ed
to
inv
est
igate
the
m
e
m
br
an
e
def
l
ect
ion
.
T
he
m
o
del
on
ly
co
ns
idere
d
the
to
p
of
the
LCP
m
e
m
br
an
e
with
the
di
m
ensio
ns
sho
wn
in
Figu
re
1.
T
he
si
m
ulati
on
was
pe
rfor
m
ed
with
a
bo
un
da
ry
load
conditi
on.
The
m
e
m
br
ane
defl
ect
ion
was
si
m
ula
te
d
us
in
g
pr
ess
ures
ra
ng
i
ng
from
0
to
50
m
m
Hg
.
The
res
ult
s
sh
owe
d
th
at
the
LCP
m
e
mb
ra
ne
defo
rm
ed
el
ast
ic
al
ly
an
d
did
not
br
e
ak
unde
r
m
axi
m
u
m
pr
essure
.
The
m
axi
m
um
de
flect
ion
of
t
he
LC
P
m
e
m
b
ran
e
di
d
not
ex
ceed
t
he
ou
te
r
m
e
m
br
ane’
s
th
ic
kn
ess
w
hic
h
sh
ow
s
that
the
sens
or
can
ope
rate
in
higher
pr
es
sur
es
as
well
.
Th
e
resu
lt
s
al
so
s
howe
d
that
the
m
axi
m
u
m
def
le
ct
io
n
occurre
d
at
th
e
center
of
t
he
m
e
m
br
ane
a
nd
the
m
axi
m
um
stress
(str
ai
n)
occ
urred
at
the
ce
nter
of
the
m
e
m
br
ane
e
dges.
T
he
strai
n
gauges
we
re
there
fore
desig
ned
to
be
placed
on
t
hese
e
dg
e
s
to
ca
ptur
e
this
high strai
n.
The
go
l
d
strai
n
gauges
we
re
de
sign
e
d
as
a
buil
t
in
Wh
eat
ston
e
bri
dge.
A
serp
e
ntine
s
ha
pe
wa
s
use
d
to
increase
the r
esi
sta
nce
of
th
e
total
strai
n
gau
ge
.
A
prot
otype
LCP
pr
ess
ur
e
se
ns
or
was
fab
ricat
ed
a
nd
te
ste
d
in
a
hydr
os
ta
ti
c
env
i
ronm
ent.
Th
e
m
easur
e
d
resist
a
nce
w
as
ap
prox
im
ately
60
%
m
or
e
than
t
he
desi
gn
e
d
no
m
inal value,
h
oweve
r,
the s
tud
y i
de
ntifie
d a dr
a
wb
ac
k
to
the d
esi
gn whi
ch
le
d
to lo
w
s
ensiti
vity
an
d
a
lim
i
t
to
the
operati
ng
pr
es
sure
range.
The
se
ns
it
ivit
y
of
the
pre
vious
desig
n
w
as
no
t
s
uffici
ent,
a
nd
the
pac
kag
i
ng
was
not
fu
ll
y
water
ti
gh
t.
The
prese
nt
stud
y
offe
rs
two
a
pproache
s
to
ov
e
rco
m
e
the
afo
rem
entione
d
sh
ort
com
ing
s
of
the
pr
e
viou
s
work
:
the
fir
st
app
r
oac
h
ai
m
s
to
i
m
pr
ov
e
the
per
f
orm
a
nce
of
the
sen
so
r
to
increase
t
he
se
ns
it
ivit
y.
In
thi
s
case,
t
he
finite
el
e
m
ent
m
e
tho
d
is
c
ho
se
n
t
o
stu
dy
the
m
echan
ic
al
be
hav
i
or
s
of
the
LCP
m
e
m
br
a
ne
defo
rm
a
ti
on
unde
r
the
operati
ng
pr
e
ssu
re
ra
nge.
T
his
stu
dy
s
ugge
sts
the
a
ppr
opriat
e
sens
or
desi
gn
wh
ic
h gen
e
rate
s h
i
gh
e
r
se
ns
it
ivit
y t
han
t
he pr
evio
u
s
one,
det
ai
ls are g
i
ve
n
i
n
Sect
io
n 2.
The
sec
ond
a
ppr
oac
h
ai
m
s
to
i
m
pr
ove
the
s
ens
or
pac
kag
i
ng
to
a
void
water
le
aka
ge
int
o
the
sen
sor’
s
cavit
y.
A
ne
w
fabrica
ti
on
pro
cess
is
pro
pose
d
to
ac
hieve
a
com
plete
LCP
ICP
m
on
it
or
in
g
pac
ka
ge
as
s
how
n
in
Figure
1.
T
he
m
ic
ro
f
abr
ic
at
io
n
pr
ocess
is
pr
i
m
aril
y
us
ed
to
dev
el
op
the
po
ly
m
e
r
-
base
d
fabrica
ti
on
pro
cess
[
15
,
16]
.
The
c
on
t
rib
ution
s
of
this
w
ork
are
as
f
ollo
w
s:
It
is
sho
wn
t
hro
ugh
finite
e
lem
ent
analy
sis
that
it
is
possible
t
o
a
chieve
a
se
ns
it
ivit
y
of
0.3
14
m
V/
mm
Hg
us
i
ng
a
se
nsor
m
e
m
br
ane
thick
ne
ss
of
20
µm
fo
r
a
press
ur
e
ra
ng
e
of
0
t
o
50
m
m
Hg
with
the
se
nsor
m
e
m
br
ane
bein
g
fa
br
i
cat
ed
from
LCP
(S
ect
ion
3).
A
n
im
pr
ov
e
d
reci
pe
for
LCP
pr
e
ssu
re
sen
sor
f
abr
ic
at
io
n
is
presente
d
(
Sect
ion
4)
.
A
com
plete
m
i
niature
,
bio
c
om
pat
ible
sensor
pac
kag
e
is
pr
opos
e
d
(S
ect
io
n
5).
The
refo
re
,
the
novel
te
chn
ic
al
resu
lt
s
pr
ese
nt
ed
in
this
wor
k
are
tw
ofold:
firstly
,
an
im
pro
ved
desi
gn
of
a
n
LCP
pr
e
ssu
re
se
ns
or
is
giv
e
n
wh
ic
h
le
ads
to
an
increase
i
n
the
sens
or’s
se
nsi
ti
vity
of
up
to
six
tim
es
that
of
the
pr
e
vi
ous
desi
gn.
Sec
ondly,
an
im
pr
ov
e
d
re
ci
pe
of
the
LC
P
press
ur
e
se
nsor
’s
fabrica
ti
on
is
prese
nted
t
hat
is
ex
pected
to
yi
el
d
a
com
plete
and w
at
e
r
-
ti
ght
p
ac
kag
i
ng s
olu
ti
on.
Figu
re
1.
Cr
os
s
-
sect
ion
al
draw
ing
of the
LCP
pressure s
ens
or c
on
sist
in
g of
top
m
e
m
br
ane
with se
ns
in
g
m
e
m
br
ane (
i
n gr
ee
n
el
li
ps
e
)
a
nd a seale
d pr
e
ssu
re
c
ham
ber
2.
RESEA
R
CH MET
HO
D
Accor
ding
t
o
the
pr
e
vious
work
[14]
,
th
e
to
p
LCP
m
e
m
br
ane
c
onsist
s
of
the
50
µ
m
sensing
m
e
m
br
ane
a
nd
bott
om
cavit
y
w
hich
is
re
quired
t
o
be
seal
ed
to
pre
ven
t
the
fl
uid
flo
w
into
the
ai
r
ca
vity
.
The
LC
P
press
ur
e senso
r
is d
esi
gn
e
d
t
o
use
LCP
pac
ka
ging d
ue
to
t
he
a
dvanta
ge
of
bi
oc
om
patibil
ity
so
a 100
µ
m
thick LCP mem
br
ane is used to
seal t
he a
ir cavity
b
y h
eat
b
ondi
ng. T
he
bo
nd
i
ng
tec
hn
i
qu
e is
desc
r
ibed
i
n
the
ne
xt
sect
io
n.
Si
nce
the
a
ppli
ed
press
ur
e
occurs
on
t
he
top
m
e
m
br
ane,
the
eff
ect
s
on
m
e
m
br
ane
de
fl
ect
ion
and
stre
ss
are
stud
ie
d
to
inv
e
sti
gate
their
distribu
ti
on.
T
he
con
cl
usi
ons
of
the
previ
ou
s
stud
y
sug
geste
d
that
the
se
ns
it
ivit
y
of
t
he
de
vice
c
an
be
im
pr
ove
d
by
dec
reasin
g
the
thick
ness
of
se
ns
in
g
m
em
br
ane,
the
va
riat
ion
of
se
ns
in
g
m
e
m
br
ane
thickne
ss
is
theref
or
e
var
ie
d
to
de
te
rm
ine
the
app
r
opriat
e
thickne
ss
to
pro
vid
e
a
higher
sensi
ti
vity
.
Evaluation Warning : The document was created with Spire.PDF for Python.
IS
S
N
:
2088
-
8708
In
t J
Elec
&
C
om
p
En
g,
V
ol.
9
, N
o.
5
,
Oct
ober
20
19
:
4
0
4
4
-
4
0
5
2
4046
Mod
el
in
g
a
nd
si
m
ulati
on
a
re
us
e
f
ul
f
or
m
ic
ro
[
17
]
and
na
no
-
scal
e
el
ect
ro
nic
desig
n
[
18]
.
A
3D
m
od
el
of
the
LCP
pres
su
re
se
nsor
is
bu
il
t
us
in
g
CO
MSOL
Mult
ip
hysic
s
(v4.3).
The
total
widt
h
an
d
thickne
ss
of
t
he
to
p
a
nd
bo
tt
o
m
m
e
m
br
anes
are
8
m
m
and
0.2
m
m
r
esp
ect
ively
.
F
or
t
he
to
p
m
e
m
br
ane,
the
cham
ber
is
seal
ed
wit
h
10
0
µm
thick
LCP
bott
om
m
e
mb
ra
ne.
The
se
ns
in
g
m
e
m
br
ane
thic
kn
es
s
is
var
ie
d
from
15
to
50
µ
m
in
ste
ps
of
5
µ
m
to
find
the
op
ti
m
al
def
le
ct
ion
that
does
not
excee
d
the
ou
te
r
m
e
m
br
ane
thickne
ss.
T
he
structu
ral
m
e
chan
ic
s
m
odule
is
app
li
ed
t
o
the
3D
m
od
el
in
sta
ti
on
a
ry
analy
sis.
L
CP
is
assum
ed
a
li
n
ear
el
ast
ic
m
ater
ia
l,
al
l
par
ts
are
analy
zed
as
li
near
el
ast
i
c
based
on
th
e
s
m
al
l
def
orm
at
ion
assum
ption
.
T
he
so
li
d
m
echan
ic
s
interface
i
s
us
ed
to
qu
a
nt
ify
and
char
a
c
te
rize
the
stress
and
dis
place
m
ent.
The
m
at
erial
pr
operti
es
a
re
s
et
with
U
LTR
ALA
M
3850
LCP
sh
eet
fro
m
Rog
er
C
orp
or
at
io
n
[8
]
a
nd
li
ste
d
in
Table
1.
A
f
ixed
co
ns
trai
nt
is
app
li
ed
t
o
the
bott
om
of
the
de
vic
e
to
avo
id
th
e
disp
la
cem
ent
of
the ove
rall
p
a
rt.
Table
1.
Ma
te
r
ia
l Proper
ti
es a
nd D
e
vice’s
D
i
m
ension u
se
d
i
n
F
EM
Prop
erties
Valu
e
Mater
i
al
Liqu
id
Cry
stal Po
l
y
m
e
r
(L
CP
)
1
.4 g
m
/
c
m
3
Yo
u
n
g
's Mod
u
l
u
s (E
)
2
2
5
5
M
Pa
0
.3
Dev
ice di
m
en
sio
n
8
x 8
x 0
.2
m
m
Sen
sin
g
m
e
m
b
rane
di
m
en
sio
n
2
x 2
x T
*
m
m
*
T
is the v
ar
iab
le
th
ick
n
ess
in th
e r
an
g
e of
2
0
-
5
0
µm
A
bounda
ry
lo
ad
is
a
ppli
ed
t
o
m
od
el
the
e
xt
ern
al
pr
ess
ure
cha
ng
e
s
ar
ound
the
de
vice.
T
his
e
xtern
al
pr
ess
ure
co
rres
ponds
to
t
he
c
hange
of
t
he
volum
e
of
the
c
avity
wh
ic
h
re
su
lt
s
in
the
pre
ssu
re
cha
nges
inside
the
ai
r
ca
vity
.
Hen
ce
,
the
i
nte
rn
al
pr
es
sure
c
han
ge
as
a
f
un
ct
ion
of
t
he
vol
um
e
is
def
ined
in
an
oth
e
r
bounda
ry
conditi
on a
pp
li
ed
in
the ai
r
ca
vity
. Th
e
inter
nal press
ur
e
cha
ng
e
(
∆
)
is wr
it
te
n i
n
(
1
)
[19]
:
P
=
0
(
(
0
)
)
−
1
(1)
w
he
re
0
is
the
am
bient
pr
essu
r
e
in
ai
r
ca
vity
,
0
is
the
unde
f
orm
ed
vo
l
um
e,
i
s
the
de
f
or
m
ed
vo
l
um
e
unde
r
the
exter
nal
pr
essure
cha
nge
and
is
the
adiabati
c
inde
x
of
ai
r.
In
t
hi
s
case,
0
=
1
at
m
,
0
=
2x10
-
6
µm
3
and
=
1.4
.
T
he
outp
uts
of
t
he
sim
ulati
on
are
the
sen
sin
g
m
e
m
br
ane
disp
l
ace
m
ent,
stress
an
d
strai
n
unde
r
a
pr
ess
ure
of
50
m
m
Hg
.
The
sensing
m
e
mb
ra
ne
dis
placem
ent
is
evaluated
to
fin
d
it
s
op
ti
m
al
thick
ne
ss,
wh
e
re
the
se
nsi
ng
m
e
m
br
ane
is
at
the
center
of
the
t
op
m
e
m
br
a
ne
as
s
how
n
in
Fig
ure
1.
The
m
axi
m
u
m
stress
is
si
m
ulate
d
to
evaluate
the
acce
ptable
thick
ne
ss
that
do
es
not
br
ea
k
the
m
e
m
br
ane
.
The
strai
n
is
evalua
te
d
to
identify
the
ap
pro
pr
ia
te
reg
i
on
on
the
m
e
mb
ra
ne
f
or
placi
ng
th
e
strai
n
ga
ug
e
s.
A
fter
the
opti
m
iz
at
io
n
t
he
strai
n
va
riat
ion
is
evaluated
w
it
h
resp
ect
to
a
pr
ess
ur
e
of
0
to
50
m
m
Hg
to
char
act
erize
the
eff
ect
of
va
ryi
ng
the m
e
m
br
ane
thickne
ss.
The
purpose
of
this
prese
nt
work
is
t
o
im
p
rove
the
se
ns
it
ivit
y
of
the
pr
e
vious
de
sig
n,
t
he
m
axi
m
u
m
strai
n
an
d
outpu
t
volt
age
ar
e
us
ed
to
obse
rv
e
the
se
ns
or
respon
se
a
nd
com
par
e
the
eff
ic
ie
ncy
betw
een
the
pr
e
vious
a
nd
pr
ese
nt
desig
ns.
T
he
resu
lt
s
of
sim
ulate
d
strai
n
a
re
us
ed
to
cal
culat
e
th
e
relat
ive
c
ha
nges
i
n
resist
ance
f
or
the
resist
ors
in
orde
r
to
obt
ai
n
the
sens
or
sensiti
vity
.
The
cha
nge
in
strai
n
f
ro
m
the
FEM
analy
sis i
s u
se
d
to
calc
ulate
t
he
se
nsor
’s o
utp
ut
volt
age
wh
en varyi
ng t
he se
ns
in
g
m
e
m
br
ane’
s
thick
ness
.
V
o
V
s
≈
−
α
4
−
α
1
−
α
4
α
1
4
(2)
wh
e
re
an
d
ar
e
the
ou
t
pu
t
volt
age
a
nd
s
uppl
y
volt
age
res
pe
ct
ively
.
1
an
d
4
a
re
t
he
relat
ive
changes
in
resist
ance
f
or
the
resist
ors
i
n
te
rm
s
of
th
e
su
r
face
strai
n
an
d
can
be
fou
nd
from
the
relat
ive
cha
ng
e
i
n
resist
ance
for
a
r
esi
sto
r
se
gm
e
nt d
e
f
or
m
ed
by
b
ei
ng
bonde
d t
o
the t
op of t
he
p
la
te
[
14]
.
3.
RESU
LT
S
A
ND AN
ALYSIS
The
FEM
re
sul
ts
sh
ow
the
de
flect
ion
,
st
res
s
and
st
rain
of
the
m
e
m
br
an
e
under
t
he
pr
essure
ra
ng
e
of
0
t
o
50
m
m
Hg.
T
he
re
su
lt
s
of
the
sim
ulate
d
strai
n
are
use
d
to
dete
rm
i
ne
the
sensiti
vi
ty
of
the
sen
sor
w
hich
is com
par
ed
t
o t
he
ex
pe
rim
ent
al
r
esults
from
the
pre
vious
de
sign.
Evaluation Warning : The document was created with Spire.PDF for Python.
In
t J
Elec
&
C
om
p
En
g
IS
S
N: 20
88
-
8708
Sensi
ti
vi
ty
a
nd
pa
ck
agin
g
im
prove
men
t
of
an LCP
pr
ess
ur
e
sens
or
fo
r
.... (Pre
edip
at
Sa
tt
ayaso
onth
or
n)
4047
3.1.
Fini
te
el
emen
t
method
for m
echanic
al pr
oper
ties
analysi
s
Figure
s
2,
3
a
nd
4
s
how
t
he
sim
ulatio
ns
of
m
e
m
br
ane
de
flect
ion
,
stress
an
d
str
ai
n
as
a
f
un
ct
io
n
of
m
e
m
br
ane
thic
kn
e
ss
un
der
a
pr
ess
ure
of
50
m
m
Hg
resp
e
ct
ively
.
In
Fig
ure
2,
if
t
he
m
e
m
br
ane
is
thin
ner
t
ha
n
20
µm
,
the
m
e
m
br
ane
will
def
le
ct
su
ch
that
it
reaches
the
bott
om
m
e
m
br
ane,
the
refor
e
f
or
this
se
ns
or
desig
n
the
sensing
m
e
m
br
ane
ca
n
only
be
con
si
de
red
in
the
ra
nge
of
20
to
50
µm
.
The
te
n
sil
e
streng
th
of
LCP
m
e
m
br
ane
is
282
MPa
,
Fig
ur
e
3
sho
ws
the
si
m
ulati
on
of
m
axi
m
u
m
stre
ss
in
the
x
-
dir
ect
ion
,
it
can
be
seen
t
hat the stres
s
do
e
s not e
xcee
d
this
value
for t
he
m
e
m
br
ane th
ic
knesses
of
20 to 50 µm
, as
su
c
h
the
m
e
m
br
ane
is n
ot expect
ed
to fai
l. Fig
ure
4
s
hows
that th
e m
axi
m
u
m
str
ai
n
is f
ound at
the edges
of th
e m
e
m
br
ane.
Figure
2
.
LCP
m
e
m
br
ane
def
l
ect
ion
for diff
e
ren
t t
hick
ness wit
h
a
press
ur
e
of
50 m
m
Hg
in
the
cr
os
s
-
sec
ti
on
al
ong
the
w
i
dt
h
Figure
3
.
X
-
co
m
po
nen
t
of the
LCP m
e
m
br
an
e stress a
s the
fun
ct
io
n o
f
m
e
m
br
ane th
ic
kn
ess un
der a
pr
e
ssu
re
of 50 m
m
Hg
in
the c
ro
s
s
-
sect
i
on al
ong t
he w
idth
Evaluation Warning : The document was created with Spire.PDF for Python.
IS
S
N
:
2088
-
8708
In
t J
Elec
&
C
om
p
En
g,
V
ol.
9
, N
o.
5
,
Oct
ober
20
19
:
4
0
4
4
-
4
0
5
2
4048
Figure
4
.
X
-
co
m
po
nen
t
of the
LCP m
e
m
br
an
e str
ai
n u
nd
e
r
a
pressure
of
50 m
m
Hg
in the c
r
os
s
-
se
ct
ion
al
on
g
t
he
w
idt
h
Hav
i
ng
sel
ect
ed
the
acce
pt
able
ra
nge
of
sensi
ng
m
e
m
br
a
ne
thic
knes
ses,
Fi
gure
5
shows
the
si
m
ulate
d
resul
ts
of
the
strai
n
va
riat
ion
as
functi
on
of
pr
e
ssu
re
for
dif
fere
nt
sensing
m
e
m
br
ane
thickne
sses
.
The
press
ur
e
is
var
ie
d
f
ro
m
0
to
50
m
mHg.
The
strai
n
ev
ol
ves
f
rom
0.
02
%
at
10
m
m
Hg
to
0.12
%
at
50
m
m
Hg
for
50
µm
.
In
the
case
of
20
µm
,
the
strai
n
var
ie
s
from
0.
15
%
at
10
m
m
Hg
to
0.7
3
%
at
50
m
m
Hg
.
Figure
6
s
how
s
the
e
vo
l
ution
of
strai
n
ve
rs
us
the
thic
kn
e
ss
of
sen
sin
g
m
e
m
br
ane
va
ryi
ng
f
r
om
20 to 5
0
µm
u
nder
a
pr
ess
ure
of 50 m
m
Hg
.
Figure
5
.
The
s
i
m
ulate
d
strai
n va
riat
ion
ve
rs
us
pr
es
sure
for vari
ou
s
se
ns
in
g
m
e
m
br
ane thi
ckn
esse
s
3.2.
Senso
r
resp
onse an
al
ys
is
The
outp
ut
vo
l
ta
ge
is
cal
c
ulate
d
by
us
in
g
t
he
res
ult
of
sim
ulate
d
strai
n
fro
m
the
FEM.
T
he
res
ults
of
ou
t
pu
t
volt
age
are
plo
tt
ed
as
a
fu
nctio
n
of
pr
ess
ure
for
di
ff
e
ren
t
sensi
ng
m
e
m
br
ane
thickne
ss
as
sho
wn
in
Figure
7.
At
50
m
m
Hg
the
evo
l
ution
of
ou
t
pu
t
vo
l
ta
ge
is
plo
tt
ed
as
a
functi
on
of
sensing
m
e
m
br
a
ne
thickne
ss,
see
Figu
re
8.
Th
e
sensiti
vity
c
an
be
obta
ine
d
from
the
gr
adient
of
the
ou
t
pu
t
volt
age
ver
s
us
pr
ess
ure
gr
a
ph
.
T
he
se
ns
it
ivit
y
pr
ese
nts
t
he
op
ti
m
iz
ed
design
to
quantify
the
m
easur
em
e
nt
ef
fici
ency
o
f
the
pr
ess
ure
sen
sor.
F
ro
m
the
gr
ap
hs
it
can
be
seen
t
he
be
st
sensiti
vity
occurs
wit
h
the
thin
nest
s
ensin
g
m
e
m
br
ane
of
20 µm
w
hich
corres
ponds t
o
th
e h
ig
hest st
rain
in
Fi
gure
6.
To
eval
uate
th
e
i
m
pr
ov
em
ent,
the
sensiti
vity
of
sim
ulate
d
resu
lt
s
an
d
ex
pe
ri
m
ental
resu
lt
are
us
e
d
to
plo
t
the
outp
ut
vo
lt
age
at
0
t
o
30
m
m
Hg
pressure
in
Fig
ure
9.
T
he
sim
ul
at
ed
res
ults
are
pr
ese
nted
at
20
an
d
50
µm
thick
sensing
m
e
m
br
ane
w
hich
a
re
0.3
14
a
nd
0.0
49
m
V/
m
m
Hg
resp
ect
ively
.
Th
e
exp
e
rim
ental
resu
lt
is
ob
ta
i
ned
fro
m
the
pr
e
vi
ou
s
desig
n
with
a
50
µm
thick
sensing
m
e
m
br
ane
a
nd
sho
wn
as
0.0
48
m
V/
m
m
Hg
.
Evaluation Warning : The document was created with Spire.PDF for Python.
In
t J
Elec
&
C
om
p
En
g
IS
S
N: 20
88
-
8708
Sensi
ti
vi
ty
a
nd
pa
ck
agin
g
im
prove
men
t
of
an LCP
pr
ess
ur
e
sens
or
fo
r
.... (Pre
edip
at
Sa
tt
ayaso
onth
or
n)
4049
The
e
voluti
on
of
t
he ou
t
put v
oltages is s
um
m
arized at the
pr
ess
ure
of
5
a
nd 30 mm
Hg
in
Ta
ble
2.
T
he spa
n o
f
var
ia
ti
on
im
pli
es
the
highe
r
s
ensiti
vity
of
th
e
pr
ese
nt
desi
gn.
Hen
c
e
,
the
20
µm
thick
sensing
m
e
m
br
ane
is
sel
ect
ed
f
or the
sen
si
ng m
e
m
b
ran
e
f
a
br
ic
at
io
n.
Figure
6
.
Ev
ol
ution o
f
sim
ulate
d
strai
n f
or va
rio
us
sensing m
e
m
br
ane th
ic
kness
unde
r
a press
ur
e
of
50 m
Hg
Figure
7
.
The
c
al
culat
ed ou
t
put vo
lt
age
varia
ti
on
ver
s
us
press
ur
e
for
va
rio
us
se
ns
in
g
m
e
m
br
ane
thickne
sses
Figure
8
.
Ev
ol
uti
on of calc
ulate
d
outp
ut
volt
age
for vari
ou
s
se
nsi
ng m
e
m
br
ane th
ic
kness
unde
r
a
pr
ess
ure
of 50
m
m
Hg
Figure
9
.
Com
par
at
ive
sensi
ti
vity
f
or
pr
ese
nt
and
pr
e
vious
desi
gns
unde
r diffe
r
ent press
ur
e
s
Table
2.
T
he
e
xp
e
rim
ental
an
d
sim
ulate
d
res
ults o
f
the
outp
ut vol
ta
ges
at 2
0
a
nd 50 µm
thickn
ess
Pressu
re
(
m
m
H
g
)
Exp
eri
m
en
tal
ou
tp
u
t vo
ltag
e
at 50
µ
m
thick
n
ess
(
m
V
)
Si
m
u
lated
ou
tp
u
t vo
ltag
e
at 20
µ
m
thick
n
ess
(
m
V
)
Si
m
u
lated
ou
tp
u
t vo
ltag
e
at 50
µ
m
thick
n
ess
(
m
V
)
5
0
.24
4
1
.55
9
0
.25
1
30
1
.46
3
9
.53
6
1
.55
8
4.
PROP
OSE
D PAC
KAGI
N
G
The
de
vice
is
desig
ne
d
to
be
fa
br
ic
at
ed
ent
irel
y
from
LC
P,
ULTR
ALAM
3850
LC
P
sh
eet
f
r
om
Rog
e
r
Co
rpo
ra
ti
on
[
20]
is
use
d
to
fabrica
te
the
co
re
la
ye
r.
P
rev
i
ous
w
ork
has
pro
ved
the
validit
y
of
the
fabrica
ti
on
pr
oc
ess
es
and
the
recipes
with
L
CP,
howe
ver,
im
pr
op
er
pack
a
ging
was
disc
usse
d
as
the
cau
se
of
po
te
ntial
water
le
aka
ge
int
o
t
he
ca
vity
of
th
e
press
ur
e
sen
s
or.
I
n
this
case
,
the
prese
nt
de
sign
is
propos
ed
t
o
i
m
pr
ove
upon
the
pr
e
vious
LCP
pack
a
ge
fa
br
ic
at
io
n.
LCP
bo
ndply
is
ap
plica
ble
to
us
e
i
n
m
ulti
la
ye
r
const
ru
ct
io
n
a
nd
la
m
inati
on
[21]
since
the
el
ect
rical
pr
op
e
rtie
s
an
d
m
oistur
e
absorp
ti
o
n
are
sim
il
ar
to
ULTR
ALA
M 385
0.
T
he
lo
w
and
sta
ble
diele
ct
ric
con
sta
nt
and
si
gn
al
los
s
m
ake
the
bondply
su
it
able f
or
h
ig
h
fr
e
qu
e
ncy
ap
pl
ic
at
ion
s
in
te
le
com
m
un
ic
at
i
on.
The
lo
w
el
ast
ic
m
od
ulu
s
pro
per
ty
offe
rs
the
be
ne
fit
in
m
echan
ic
al
flexibili
ty
.
The
m
el
t
ing
tem
per
at
ur
e
of
L
CP
bondply
is
approxim
at
e
ly
28
5
°c
w
hich
is
le
ss
than
that
of
ULTR
ALA
M
38
50
(
315°
c
),
s
o
this
pro
per
ty
facil
it
at
es
the
proces
s
of
t
her
m
al
bond
i
ng.
ULTR
ALAM
3908
bondply
sh
eet
is
us
e
d
to
adhere
the c
or
e lay
ers.
Evaluation Warning : The document was created with Spire.PDF for Python.
IS
S
N
:
2088
-
8708
In
t J
Elec
&
C
om
p
En
g,
V
ol.
9
, N
o.
5
,
Oct
ober
20
19
:
4
0
4
4
-
4
0
5
2
4050
The
pr
es
ent
de
sign
c
onsist
s
of
tw
o
c
or
e
la
ye
rs
(t
op
an
d
bott
om
)
and
a
n
a
dhesi
ve
la
ye
r
.
T
he
to
p
c
or
e
la
ye
r
is
fabrica
te
d
as
s
how
n
in
Fig
ur
e
10.
A
10
0
µm
t
hick
LCP
c
oppe
r
cl
ad
is
te
m
porar
il
y
at
ta
ch
ed
to
a
sil
ic
on
wafer
by
us
in
g
ph
otoresi
st
and
trans
ferred
th
e
sq
ua
re
m
as
k
onto
the
to
p
surface
as
sh
ow
n
in
Fig
ur
e 10(a
)
.
The
bar
e LCP
betwee
n
the
s
qu
a
re
m
ask
is
et
ched
to buil
d
the
20
µm
thick
se
ns
in
g
m
e
mb
ra
ne
an
d
t
he
ca
vity
.
The
t
op
c
op
per
la
ye
r
is
th
en
et
che
d
off
as
show
n
in
F
igure
10(
b).
T
he
to
p
co
re
la
ye
r
is
rem
ov
ed fr
om
the sili
con w
a
f
er
by u
si
ng ace
ton
e a
s s
how
n i
n
Fig
ure
10(c).
(a)
(b)
(c)
Figure
10.
T
op
core lay
er
fabr
ic
at
ion
: (a
)
Etc
hed an
d sq
uar
e
-
patte
r
ned LCP
sh
eet
for
LC
P
et
ching pr
oces
s,
(b) 20 µm
thic
k
se
ns
in
g
m
e
m
br
a
ne
a
fter
LCP et
chin
g , a
nd (
c)
T
op core l
ay
er af
te
r
r
em
ov
in
g photo
resis
t
The
bott
om
cor
e
la
ye
r
is
fab
r
ic
at
ed
as
sh
ow
n
in
Fig
ur
e
11.
Anothe
r
100
µ
m
thick
LCP
coppe
r
cl
ad
is
tem
po
rar
il
y
at
ta
ched
to
a
sil
ic
on
waf
e
r
to
et
ch
the
top
coppe
r
la
ye
r
as
sh
ow
n
in
Fig
ure
11(a).
The
bott
om
cor
e
la
ye
r
is
re
m
ov
ed
from
th
e
su
pp
or
t
wa
fe
r
as
show
n
in Fig
ure
11(
b). N
ext, U
LTR
A
LAM
3908 b
ond
ply
is
cut
to m
ake
2x2
m
m
2
window and ali
gnm
ent m
ark
s w
it
h
a
CO
2
la
ser.
(a)
(b)
Figure
11. B
ottom
co
re lay
er
f
abr
ic
at
io
n: (
a
) Et
ched to
p
c
opper la
ye
r
of LC
P sh
e
et
and (
b) Bott
om
core lay
er a
fter r
em
ov
in
g p
hoto
resist
The
bond
ply
sh
eet
is
sa
ndwi
ched
bet
wee
n
the
co
re
la
ye
r
s
by
us
in
g
al
i
gn
m
ent
m
ark
s
an
d
passe
d
thr
ough
the
th
erm
al
bo
ndin
g
as
s
how
n
i
n
Figure
12(a
).
Both
c
oppe
r
l
ay
ers
are
et
ch
ed
off
as
s
hown
i
n
Figure
12
(b).
The
to
p
co
re
la
ye
r
is
deposite
d
with
the
ph
otoresi
st
and
t
ra
nsfer
re
d
the
serp
e
ntine
m
as
k
by
us
in
g
back
si
de
al
ign
m
ent
in
photo
li
th
ogra
phy
proces
s.
Ti
/Au
is
s
putt
ere
d
on
t
he
s
urfa
ce
to
m
ake
m
et
al
lic
strai
n
ga
uges
a
s
show
n
in
Fig
ur
e
12(c
)
an
d
passe
d
to
the
l
iftof
f
proce
ss
to
rem
ov
e
phot
or
esi
st
a
nd
le
a
ve
the
strai
n gau
ges
a
s sho
wn in Fi
gure
12(d
).
(a)
(b)
(c)
(d)
Figure
12. Pac
kag
i
ng for LC
P press
ur
e
se
nsor:
(a) Sa
ndwi
ched co
ns
tr
ucti
on of t
op core l
ay
er, bon
dp
ly
and
bo
tt
om
co
re
lay
er af
te
r
the
rm
al
b
on
ding, (
b) Exp
os
ed
LCP
after c
oppe
r
et
chin
g,
(c) P
ho
t
or
esi
st
de
po
sit
ion
and Ti/
A
u
s
pu
t
te
ring on t
he
to
p
c
or
e
lay
er,
a
nd (d) B
on
ded
LCP p
ress
ur
e
s
ens
or
with
gold se
rp
e
ntine
str
ai
n
gauges
after
li
f
t
-
off pr
ocess
Evaluation Warning : The document was created with Spire.PDF for Python.
In
t J
Elec
&
C
om
p
En
g
IS
S
N: 20
88
-
8708
Sensi
ti
vi
ty
a
nd
pa
ck
agin
g
im
prove
men
t
of
an LCP
pr
ess
ur
e
sens
or
fo
r
.... (Pre
edip
at
Sa
tt
ayaso
onth
or
n)
4051
5.
DISCU
S
S
I
ON
A
pac
ka
ged
L
CP
pr
es
sure
se
ns
or
is
pr
opose
d
an
d
a
naly
zed
f
or
ICP
m
on
it
or
in
g.
T
his
present
st
udy
sh
ows
that
dec
reasin
g
the
thickne
ss
of
the
LCP
sensing
m
e
m
br
ane
can
i
m
pr
ov
e
the
s
ensiti
vity
of
the
dev
ic
e
.
The
sim
ulati
on
res
ults
at
20
µ
m
thick
sensi
ng
m
e
m
br
ane
in
dicat
es
m
or
e
th
an
a
si
x
-
fo
l
d
in
crease
in
sensit
ivit
y
wh
e
n
c
om
par
ed
to
ex
pe
rim
en
ta
l
resu
lt
s
with
a
50
µm
thick
sensing
m
e
m
b
ran
e
that
was
r
eported
in
pr
e
vious
work
[14]
.
The
re
are
oth
e
r
al
te
rn
at
ive
ways
to
possibly
i
m
pr
ove
the
sen
sit
ivit
y
su
ch
as
in
creasin
g
the
nu
m
ber
of
tu
rns
of
the
serp
e
ntine
strai
n
ga
ug
e
,
w
hich
can
be
done
by
decr
easi
ng
th
e
strai
n
gauge
width.
A
no
t
her
way
to
inc
rease
se
ns
it
ivit
y
is
ch
ang
i
ng
the
pl
ace
m
ent
of
st
rain
ga
ug
e
s
t
o
be
on
t
he
sensing
m
e
m
b
ran
e
.
The
pro
pose
d
f
abr
ic
at
io
n
proc
ess
will
le
ad
to
a
co
m
plete
L
CP
structu
re
w
hich
can
be
use
d
as
a
m
iniat
ur
e
an
d
bio
c
om
patible
sens
or
.
A
he
r
m
et
ic
pack
a
ge
will
be
con
si
de
red
in
f
urt
her
fab
ricat
io
n
pr
ocess.
I
n
f
utur
e
wo
r
k,
the
com
plete
d
LCP
sen
sin
g
unit
will
be
int
egr
at
e
d
wit
h
the
data
tran
sm
issi
on
unit
that
inclu
des
the
powe
r
so
urce
of
the
sens
or
.
LCP
s
he
et
will
be
us
ed
to
support
th
e
el
ect
rical
co
m
po
nen
ts
an
d
encapsulat
e
th
e
data
transm
issi
on
unit
.
Alth
ough
it
is
well
kn
own
t
hat
reduci
ng
t
he
sens
or
m
e
m
br
ane
thi
ckn
e
ss
im
pr
oves
the
sensiti
vity
of
a
sens
or,
it
has
been
sho
w
n
in
this
w
ork
that
us
in
g
a
20
µm
LCP
press
ur
e
s
ens
or
t
hick
nes
s
will
yi
el
d
a
fu
ll
y
functi
on
al
se
nsor
ov
e
r
the
requi
red
pr
e
ssure
ra
ng
e
f
or
ICP
m
on
it
ori
ng.
T
his
resu
lt
ha
s
not
bee
n
pr
ese
nted
else
wh
e
re.
6.
CONCL
US
I
O
N
This
work
pre
sents
a
detai
le
d
desig
n,
sim
u
la
ti
on
-
based
c
har
act
erizat
io
n,
an
d
pro
posed
fabrica
ti
on
process
of
a
pa
ckag
e
d
LCP
pr
ess
ure
sens
or
for
intracra
ni
al
pr
essu
re
sensing.
T
he
de
sign
is
stud
ie
d
and
op
ti
m
iz
ed
to
im
pr
ov
e
t
he
se
nsi
ti
vity
of
the
s
ens
or
.
T
he
m
ajo
r
physi
cal
cha
racteri
sti
cs
an
d
de
vice
beh
a
vi
or
are
m
od
el
ed
via FEM. Th
e stu
dy sh
ows that the
p
r
opos
e
d
desi
gn
of
a 20
µm
thick sen
si
ng
m
e
m
br
ane can
op
e
rate
unde
r
the
pres
su
re
range
of
0
to
50
m
m
H
g
with
a
sensi
ti
vity
of
0.
31
4
m
V/
m
m
Hg
.
A
detai
le
d
fa
bri
cat
ion
process
is
pro
pose
d
to
com
plete
the
L
CP
pack
age
.
The
pro
pose
d
desig
n
re
pr
ese
nts
a
ste
p
towards
reali
z
ing
a
m
iniat
ur
e b
i
oc
om
patible
w
ire
le
ss pressure
s
ens
or
f
or
t
he u
se in
ICP m
on
i
toring a
nd
healt
hcar
e a
ppli
cat
i
on
s
.
ACKN
OWLE
DGE
MENTS
This
res
earc
h
has
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f
unde
d
by
FY2
016
Thesis
Gr
a
nt
f
or
D
octoral
De
gr
ee
Stu
den
t
unde
r
Nati
on
al
Re
search
Co
unci
l of
T
haila
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th
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U
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